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Low-Profile Heat Sinks Cool Hot Components in Constricted Packages
Lower-height maxiFLOWTM heat sinks, recently introduced by Advanced Thermal Solutions, use a spread fin array that is said to maximize surface area for more effective convection (air) cooling.
Image courtesy of ATS.
NORWOOD, Mass.--Advanced Thermal Solutions, Inc. (ATS), an engineering and manufacturing company focused on thermal management of electronics, has introduced a line of lower-height maxiFLOWTM heat sinks for cooling integrated circuits (ICs) and other hot components in narrow packaging and low airflow-velocity conditions. A prominent feature of the maxiFLOW heat sinks is a spread fin array that reportedly maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm, according to the manufacturer.
The heat sinks are fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins and minimizes weight. According to ATS, tests on maxiFLOW heat sinks using an airflow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using other heat sinks.
Low-profile maxiFLOW heat sinks are provided pre-assembled with ATS maxiGRIPTM mounting hardware. The attachment system includes a plastic frame clip that snaps securely around the component. A stainless steel spring clip runs through the fin field and fastens to the frame. The result is steady, even mounting pressure with no holes in the PCB.
The assemblies are reported to meet Telcordia GR-63-Core, ETSI 300 019, and MIL-STD-810 shock and vibration testing standards. A thermally conductive, phase-change interface pad is said to maximize heat transfer from component to the cooling solution.
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