Aluminum clad T-lam is a thermally conductive PCB (Printed Circuit Board) substrate providing 8-10 times the heat dissipation compared to conventional FR4-based PCBs. The miniaturization of electronic devices continues to pack more and more power into smaller and smaller packages. The simplicity of the T-lam system takes the heat dissipation requirement in stride without significant design changes. The T-lam dielectrics are the key to these high-performance PCB substrates. The T-lam dielectric provides electrical isolation, thermal transfer, and adhesion layer for the substrates that are created for your specific needs.