Speedier transmission of information is the ultimate payoff as microelectronic devices continue to get smaller and smaller. Today, contract electronics manufacturers have the technology and skills to make it happen. Adding momentum to the move toward smaller circuitry are technologies such as ball grid arrays, flip chips, and chip-scale packages, all of which permit faster transmission of information through greater board densities.

At the same time, numerous pressures are causing many OEMs to seek the expertise of outside sources.KEYWORDS for this process: assembly