The growth in demand for smaller, lighter and higher performance electronics products has stimulated the miniaturization of electronics devices. A flexible circuit interconnect addresses some of the challenges of miniaturization since it can bend. After fabrication, components such as integrated circuits, speakers, microphones and switches are then added using advanced chip on flex or surface mount assembly processes.

The ability of a flexible circuit interconnect to conform to sharp packaging contours has made it a leading driver of the ongoing reductions in the size of such popular products as cellular telephones. Its excellent electrical performance and ability to bend millions of times over the course of its life makes it a preferred interconnect solution in many applications, including hard disk drives and connecting flip-up displays in today's powerful notebook computers.