Ultrasonic machining is the result of converting electrical energy into mechanical motion. The mechanical motion is typically linear in a frequency range of 20KHZ - 100KHZ. The energy is transferred into a tool to either impart work (material removal) into a workpiece or reduce the frictional forces of conventional machining. Since this machining method is usually employed to hard brittle materials, material removal usually involves abrasives as the transfer mechanism for the energy which provides useful work into a workpiece.

Applications:

• UM is used to drill IC (Integrated circuit) substrates where the through port created is used for pressure/vacuum transfer to a silicon IC.
• UM is used to drill ceramic substrates for the incorporation of electronic circuit connector pins.
• UM is used to remove broken tooling where EDM or laser poses too great of a risk of damage to a high value part.

KEYWORDS for this process: grinding, microdrilling, drilling