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New Release Digitally Threads Simulation Across Product Lifecycle Processes


In ANSYS 2020 R1, ANSYS Discovery Live introduces a steady-state fluids solver for quickly solving thermal mixing scenarios and parametric studies. Image courtesy of ANSYS.

PITTSBURGH–Engineering simulation software developer ANSYS, Inc., has made available new functionalities in its latest release, ANSYS 2020 R1, that can help companies integrate ANSYS technology across product lifecycle processes, the company said in a press release.

As simulation impacts virtually every product development decision, engineers must address considerable challenges of interoperability, data and process management, high-performance computing (HPC) integration, and traceability. But what if sophisticated multiphysics simulation and optimization assets were widely available throughout engineering teams and across product lifecycles? ANSYS addresses this through ANSYS 2020 R1, reported to provide portfolio-wide upgrades and improvements to ANSYS Minerva that enable customers to connect simulation and optimization to their larger product lifecycle processes.

ANSYS Minerva helps companies transform simulation intellectual property into a valuable and controlled corporate asset, capture best practices, and digitally thread simulation and optimization more broadly across the enterprise. With the latest release, Minerva now incorporates advanced technologies for significantly improving workflows and enhancing simulation process and data management (SPDM), ANSYS said. This includes dashboards that drive improved decision support, dynamic 3D visualization tools for exploring model data, and a state-of-the-art system for managing change and ensuring reliability of information.

OptiSlang, a technology now owned by ANSYS as a result of the recent acquisition of Dynardo, now teams with Minerva’s SPDM solutions to help users reduce development time and expedite the evaluation of affordable optimal design alternatives.


The new ANSYS GRANTA MI Pro fast-start data management solution enables access to managed materials data from within ANSYS Mechanical. Image courtesy of ANSYS.

“Navigating digital transformation is about adapting to a constantly evolving environment and using existing tools and data in new ways,” said Todd Earls, vice president of Information Technology at Eaton, in a release from ANSYS. “With use of simulation expected to expand in the coming years, Minerva is important to Eaton and plays a key part in our larger, enterprise-wide digital prototyping and additive manufacturing (AM) initiatives. Additionally, traceability and management are essential for efficiency, and there are many steps necessary to design and manufacture parts using AM or other processes. ANSYS Minerva will help make our user experience more streamlined than it is today.”

An interoperable knowledge management application engineered with an open and vendor-neutral architecture, Minerva is said to integrate with engineering teams’ ecosystems of simulation tools and enterprise systems and streamline collaboration and traceability across teams based around the world.

In ANSYS’s fluids suite, Fluent introduces new features that are said to make it easy for nearly anyone – from novices to experts – to effectively run high-quality, complex, multiphase computational fluid dynamics simulations. With a simplified and streamlined workflow, simulations can be set up 25 percent faster. Fluent users are also supported by an immersive and highly intuitive graphical user interface, enabling them to directly interact with models and graphical elements to help speed set up, according to ANSYS.

The electromagnetic suite introduces advances in ANSYS HFSS for quickly and accurately modeling antenna arrays, key for enabling 5G. For high-speed electronics, HFSS is reported to deliver remarkable solving speed for very large simulations, recently slashing compute time from 50 hours to 5 hours for a specific benchmark.

New upgrades in the area of electronics design enable users to predict and resolve printed circuit board electromagnetic interference and run transient thermal analyses to ensure highly reliable designs. Also, in the electromagnetic suite, ANSYS Maxwell delivers a new multiphysics solver designed to predict noise and vibration in electric vehicle (EV) powertrains, boosting EV overall reliability and performance, the company said.

ANSYS’s materials suite updates ANSYS® GRANTA MITM, focusing on optimizing user experience for enterprise-wide implementations. The suite also introduces ANSYS GRANTA MI Pro, a new fast-start data management product for design and simulation – broadening access to the numerous benefits of material intelligence.

ANSYS said that users can explore designs faster with ANSYS® DiscoveryTM Live’s new steady-state fluids solver and an updated structural solver that also improves accuracy for thinner geometries. Users also receive upfront design insights with the addition of manufacturing constraints and multi-analysis optimization for generative design, the company said.

This technical information has been contributed by
ANSYS

Click here to find suppliers

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