Micro Power Connectors Deliver High Current Density in Common Industry Footprint, Company Says
TE Connectivity's ELCON Micro power connectors deliver high current density in a commonly used industry footprint of 3.0mm. (PRNewsfoto/TE Connectivity)
HARRISBURG, Pa.–TE Connectivity (TE), the developer of connectivity products and sensors, has introduced its ELCON Micro power connectors, reported to deliver high current density in a commonly used industry footprint of 3.0mm. The new connectors provide 12.5A per pin, making them useful for servers, switches, storage devices, and testing machines, TE said in a press release.
TE's Elcon Micro power connectors use a common industry footprint to allow for easy upgrades to existing designs. The 3.0mm printed circuit board (PCB) footprint is compatible with Molex's Micro-Fit headers and BellWether's Micro-Hi headers. The new connectors support 2- to 24-pin configurations and are said to perform reliably in harsh environments due to their maximum operating temperature of 105 degrees Celsius and their halogen-free material.
The connector housing is designed to prevent mis-mating, making assembly easier for customers, the company said.
"High power and reliable connectivity in an easy-to-use form factor are the key features of our new ELCON Micro power connectors," said Henry Xie, power product manager at TE Connectivity (www.te.com), in the release. "With a working voltage of 600V and the ability to support different currents with multiple combinations of different wire sizes, these connectors offer the flexibility and performance to make them standouts in the power connector market."
ELCON, TE, and TE Connectivity are trademarks of TE Connectivity Ltd. family of companies.
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