Partnership Aims to Redefine Design Capabilities for Complex Electronic Systems, Mobility
Siemens and Arm are working to help automotive companies innovate
PLANO, Texas–A new partnership between Siemens Digital Industries Software and Arm, a global developer of semiconductor IP, will bring together leading edge IP, methodologies, processes, and tools for the benefit of the automotive industry. The goal is to help automakers, integrators, and suppliers collaborate, design, and bring to market their next-generation platforms much faster, according to a release from Siemens Digital Industries (DI).
Key advances in computing and sensor technology, beginning with the integrated circuits and software within automotive electronics systems, are enabling companies to redefine mobility. Yet formidable obstacles remain. The Siemens-Arm partnership was formed to address increasingly complex challenges facing the automotive industry, including the development of platforms to realize active-safety, advanced driver assistance, and self-driving vehicles. It will also focus on development of platforms for in-vehicle infotainment, digital cockpits, and vehicle-to-vehicle/vehicle-to-infrastructure, Siemens said.
Siemens’ PAVE360TM digital twin environment incorporates Arm IP. It applies high-fidelity modeling techniques, from sensors and integrated circuits (ICs) to vehicle dynamics and the environment within which a vehicle operates. Using Arm IP, digital twin models can run entire software stacks to provide early metrics of power and performance.
“Developing future transportation solutions requires collaboration across complex ecosystems,” said Dipti Vachani, senior vice president and general manager for Arm’s automotive and IoT line of business, in the release. “Arm technology has been deployed in applications across the whole vehicle for more than two decades, and our collaboration with Siemens redefines what is possible in terms of safety-capable, scalable heterogeneous compute. We see this as an important catalyst for the next wave of automotive semiconductor innovation.”
Using Siemens’ PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system-on-chip (SoC) designs. By doing so, they can better understand how they perform within a vehicle design from the silicon level up, long before the vehicle is built.
According to Siemens (www.siemens.com), Arm’s automotive IP is helping to democratize the ability to create safety-enabled silicon, bringing it within reach of the entire automotive supply chain. By rethinking IC design for the automotive industry, manufacturers can consolidate electronic control units (ECUs), leading to thousands of dollars in savings per vehicle by reducing the number of circuit boards and meters of wire within the vehicle design. This in turn reduces vehicle weight, which can promote longer range electric vehicles.
“In all we do at Siemens, our goal is to provide transportation companies and suppliers the most comprehensive digital twin solutions, from the design and development of semiconductors, to advanced manufacturing and deployment of vehicles and services within cities,” said Tony Hemmelgarn, president and CEO at Siemens Digital Industries Software. “Siemens believes collaboration with Arm is a win for the entire industry. Carmakers, their suppliers, and IC design companies all can benefit from the collaboration, new methodologies, and insight now sparking new innovations.”
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