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Semiconductor Packaging Specialist Provides Design, Manufacturing, and Assembly
High-power semiconductor package design and assembly; post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages; and high-frequency, high-speed, thermally efficient packages and assembly packaging services are specialties of StratEdge Corporation. Photo courtesy of StratEdge.
SAN DIEGO– High-power semiconductor package design and assembly. Post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages. High-frequency, high-speed, thermally efficient packages and assembly packaging services. These are a few of the capabilities that StratEdge Corporation was preparing to exhibit at three technical conferences–IMAPS Device Packaging, APEC, and GOMACTech–as D2P went to press in March.
StratEdge designs and manufactures high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, and provides chip assembly services.
The company specializes in packages for high-frequency, very high power, and extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Its post-fired, molded ceramic, and ceramic QFN semiconductor packages operate from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards.
“Our goal at StratEdge is not only to provide the highest quality and reliability packages and packaging assembly services,” said Tim Going, president of StratEdge. “We want to ensure that the package a customer selects is the best one for the device that’s packaged and the application.”
StratEdge’s packages meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices and the critical requirements of numerous markets. Among them are telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole drilling, and MEMS.
The company said in a press release that its LL family of leaded laminate copper-moly-copper (CMC) base packages and its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz. These packages provide enhanced thermal dissipation for high-power gallium nitride devices and come in fully-hermetic versions in over 200 standard outlines, StratEdge said.
StratEdge (www.stratedge.com) recently moved its global headquarters to Santee, California, where the company’s new ISO 9001:2015 facility features a Class 1000 cleanroom that includes Class 100 work areas with ESD control for performing sensitive operations. For more on the new facility, see StratEdge Opens New Global Headquarters Near San Diego.
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