This technical information has been contributed by

Non-Hermetic Thermoelectric Cooler Reported to Reduce Power Consumption in Optical Networking Equipment

Phononic’s Non-Hermetic Thermoelectric Cooler is said to be designed for the demanding and ever-changing thermal needs of optical communications equipment. (Photo: Business Wire)

The TEC platform is recognized as a top product by Lightwave’s Innovation Reviews

DURHAM, N.C.–A thermoelectric cooler platform from Phononic is re-engineered from the ground up to provide high reliability and best-in-class cooling performance for non-hermetic laser packaging. ReefTECTM, the proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform recently made available by Phononic, was recognized as an honoree in the 2019 Lightwave Innovation Reviews program.

Phononic, a developer of solid-state thermal management components, was scheduled to receive the award at the Optical Networking and Communication (OFC) Conference on March 4 in San Diego.

The Non-Hermetic Compatible Thermoelectric Cooler Platform builds upon Phononic’s expertise in cooling optoelectronic components and is uniquely designed for the demanding and ever-changing thermal needs of optical communications equipment, Phononic said in a press release. It is said to dramatically improve survivability in the most challenging non-hermetic environments relative to traditional TECs, while still reducing overall TEC and TOSA (transmitter optical subassembly) power consumption.

“The optical communications market is facing intense pressure to reduce package and product costs, while still keeping pace with increasing network speeds required by 5G and modern data center applications,” said Alex Guichard, Phononic’s director of product marketing, optoelectronics, in the release. “We are thrilled to announce general availability for this TEC platform, and in tandem, have this technology recognized by Lightwave. This further validates our mission to provide to the optical communications market a non-hermetic solution that offers dramatically improved robustness in non-hermetic environments without sacrificing performance.”

Phononic ( developed this platform throughout 2018 while working in partnership with leading optical components manufacturers on their cooled, non-hermetic transmitter optical subassembly development programs.

“The feedback we consistently received from our partners was our TEC had to be resilient to environmental challenges that could arise for a cooled laser operating in a non-hermetic environment,” said Kevin Granucci, Phononic’s vice president and general manager of optoelectronics. “This platform surpasses those expectations. Today’s general availability announcement is emblematic of our confidence in the vetting we have conducted with our partners.”

“Cooled, non-hermetic laser packages represent a vast opportunity to fundamentally change the trade-offs between cost and performance in optical transceivers,” said Vladimir Kozlov, founder and CEO of LightCounting. “Packaging technologies like chip-on-board and photonic integration will achieve unprecedented cost per bit for next-generation optical components.”

Presented annually by Lightwave, the Lightwave Innovation Reviews program distinguishes top products and solutions available within the optical networking industry. Judges include industry executives and analysts from a wide variety of service providers, technology developers, industry analysts, and journalists. The Innovation Reviews are judged based on the criteria of originality, innovation, positive impact on the customer, how well it addresses a new or existing requirement, novelty of approach, and cost-effectiveness.

“The 4.0 score [that] Phononic’s Non-Hermetic Thermoelectric Cooler achieved indicates how well the product can meet customer needs,” said Stephen Hardy, editorial director of Lightwave and program director of the 2019 Lightwave Innovation Reviews. “Our judges cited the cooler’s performance and power-saving features in their ratings.”

This technical information has been contributed by

Home |  About Us |  Back To Technical Library |  Contact Us
Copyright © 1996-2010 All Rights Reserved.
General or Technical Questions? E-mail