This technical information has been contributed by
Photofabrication Engineering, Inc.

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Etched Step and Flat Lids Available with Sputtered Getters to Absorb Moisture

Photochemical Etching and Machining

MILFORD, Mass.--Photofabrication Engineering, Inc. (PEI) is offering custom and standard step lids and flat lids for seam-weldable microelectronic packages, available with sputtered getters for moisture absorption, the company recently announced. The standard base material for PEI's lids is etching-grade iron-nickel-cobalt alloy, but PEI says that it can also etch lids from other materials, including Nickel-200, stainless steel, and cold rolled steel. Plating and finishing options--including gold plate, electrolytic nickel, electroless nickel, and selective plating--are also available.

According to PEI, package and hybrid manufacturers may purchase lids to a given print or by specifying the package to which the lid will be welded. The company's standard tooling list reportedly has lids "to meet almost every common specification." Custom lids are available with a one-time tooling charge that may be absorbed on large-volume orders.

Photofabrication Engineering (www.photofabrication.com) will design lids "to exact customer dimensions and specifications" to ensure a precise fit on customer packages, and will guarantee the proper fit. For 0.010-inch (0.254 mm) to 0.015-inch (0.381 mm) lids, the typical tolerance is ± 0.003 inch (0.076 mm) on features and ± 0.001 inch (0.025 mm) on the flange. Flatness will be held to 0.002 inch (0.05 mm) per inch (25.4 mm). On lids 0.020 inch (0.5 mm) or greater, typical tolerances vary as a result of material thickness.

This technical information has been contributed by
Photofabrication Engineering, Inc.

Click on Company Name for a Detailed Profile

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