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Proprietary Process Reported to Metallize Virtually Any Surface While Simplifying PCB Production
The eSurface patented process significantly reduces the manufacturing steps in the production of printed circuit boards, providing significant cost and time savings versus current manufacturing technology. It nearly eliminates the toxic waste generated by conventional manufacturing methods, and reportedly allows conductive material to be embedded in virtually any surface that can receive an image.
Photo courtesy of eSurface® Technologies.
CARLSBAD, Calif.—eSurface® Technologies, the developer of a new time- and cost-saving process for printed circuit boards, recently announced it has been granted two patents by the United States Patent and Trademark Office.
The eSurface patented process is available by license for the manufacture of printed circuit boards and other electronic components. The patented technology allows for significant process cost savings versus current manufacturing technology, almost completely eliminating the toxic waste generated by conventional manufacturing methods, and allows conductive material to be embedded in virtually any surface that can receive an image, according to company representatives.
The granted patents cover the areas of surface activation and metallization and relate to the proprietary method for the metallization of a non-conductive surface. The eSurface® Technologies patented process is said to significantly increase the ability to manufacture printed circuit boards with ultra-fine capabilities < 1/1 L/S, through selective metallization and controlled fine feature build-up, dramatically improving production yields for printed circuit board manufacturers.
The eSurface® Technologies patented process comprises six process steps, all of which can be accomplished with standard industry equipment and processes.
Photo courtesy of eSurface® Technologies.
While the primary addressable market of eSurface Technologies is circuit fabrication, the non-circuit applications are significant when the bonding of a metal in a surface is required or advantageous. "Securing patent rights on such a critical market advancement places eSurface Technologies in an exceptional market position," said David Martin, Ph.D., eSurface Technologies Advisory Board Member and founding CEO of MCAMTM, in a press release.
The introduction of these patents will affect a multitude of industries and business sectors, Martin explained. However, with the initial commercial industry launch within the electronics business sector, eSurface is making a tremendous impact, he said.
"As the world increasingly depends on printed circuit board technology, eSurface Technologies' patented innovation represents a radical step forward in manufacturing versatility, device functionality, and product innovation," Martin continued in the press release. While there's been a proliferation of production process efficiency, miniaturization, and substrate improvements in the industry, these patent claims and the underlying technology represent a paradigm shift in the science of PCB form and function which will be indispensable to the success of licensed manufacturers' products."
eSurface® Technologies (www.esurface.com) is the creator of the eSurface process, a proprietary patented process intended to impact the manufacturing and design segment of multiple industries. The initial adoption of the eSurface proprietary process by the global circuit board manufacturing industry is leading to the innovation of products across many manufacturing markets previously not thought possible, according to company representatives. The company is currently looking into entering the wearable electronics, automotive, solar, and space product manufacturing sectors. eSurface Technologies (doing business as EarthOne Circuit Technologies Corporation, a privately-held corporation) is based in Carlsbad, California.
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