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Micro-USB Interconnects Save Space, Speed Data Transfer
ASTORIA, N.Y--Keystone Electronics has introduced a new series of advanced Micro-USB plugs and sockets with up to 4.8Gbps data transfer speeds, the company announced recently. The sockets reduce PCB footprints and support On-the-Go (OTG) technology for mobile device connectivity without a host computer, according to a statement announcing the release.
Designed for increased durability, the new USB 2.0 and USB 3.0 products are reported to withstand greater than 10,000 mating cycles. Micro configurations provide the smallest PCB footprint of all USB interconnects, significantly reducing PCB real estate. In addition, the company says, a unique socket lead-in design enables blind-mating with the plug. Plugs and sockets are manufactured with gold-plated contacts for reliability and low contact resistance.
The company also reports that its Type B Micro-USB Plug kits, Cat. No. 941 for USB 2.0 applications and Cat. No. 947 for USB 3.0 applications, are well-suited for creating custom cable assemblies. Kits are supplied with an unassembled metal housing with strain relief.
Keystone Electronics Corp. (www.keyelco.com) is a major manufacturer of interconnect components and hardware, and provides a full complement of stamping, machining, and assembly services. An in-house application engineering group is also on hand to aid in product modifications or customers' special designs.
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