Multek Opens Interconnect Technology Center In Silicon Valley
SAN JOSE, Calif.--Multek has announced the opening of its new Interconnect Technology Center (ITC) in Silicon Valley to support the development of new technology and new product introduction for its global customer base.
"Our Interconnect Technology Center will focus on future technologies for the printed circuit board industry with the understanding that critical decisions are made specific to connections within the board and the device as a whole," said Franck Lize, president of Multek, in a statement. "Our specialized team at the ITC are at the forefront in advanced printed circuit board technology and will concentrate on solving our customers' most significant technology challenges."
Multek's ITC aims to identify industry gaps and trends that are emerging in areas such as advanced material development, embedded components, high density interconnect (HDI) flexible and rigid-flex product development, thermal management, and signal integrity. In addition, complementing Multek's existing capabilities, the Center will support customer-driven early product introductions and prototype projects that integrate material and process concepts.
"Products today have become more complex and require more reliable and higher technology in a more competitive total interconnect solution," said Bill Beckenbaugh, Multek's chief technology officer. "Our Interconnect Technology Center will work closely with customers to understand their technology roadmaps and solve their most challenging problems. This will enable Multek to develop solutions for the rapidly changing technologies needed for tomorrow's electronic hardware and commercialize these technologies within our Silicon Valley campus."
Multek, a wholly owned subsidiary of Flextronics, offers a broad spectrum of PCB engineering and manufacturing expertise, including high density interconnect, multilayer, flexible circuit, and assembly solutions.
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