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ASIC Program for IoT Products Improves Designs for Manufacturing, Protects from Copycats

AUSTIN, Tex.— Tekmos, Inc., recently announced its new mixed signal, application-specific integrated circuit (ASIC) program aimed at solving engineering and device issues for companies developing an Internet of Things (IoT) product offering, “where the standalone processor and other standard components provide 90% of the solution, but not the 10% needed to finish the product.”

Many companies have defined their product at the block diagram level and have the resources to design in processors and other devices, according to a release from Tekmos. However, they lack the engineering resources at the chip level to provide an optimal integration of mixed signal and other interface functions quickly and for a reasonable entry price, the company says.

The UNIFY ASIC from Tekmos is said to include higher level integration, which may include mixed signal, power management functions, custom interface design, digital logic, or special IP from field-programmable gate arrays (FPGAs). The UNIFY offering can include stacked die with flash memory or other technologies to create “a solution that uses much less board area and offers cost savings for programs,” according to the release.

Tekmos says that the ability to combine mixed signal ASIC with other die in a stacked die solution is tailor made to the customer’s application. UNIFY reportedly provides higher integration, lower cost, and proprietary security advantages to make it more difficult for the competition to copy customer product designs. It offers these benefits without the customer’s having to hire chip designers. Tekmos will implement the customer’s requirements into the ASIC, which is then embedded with the other devices into a single package or module to greatly reduce board area and protect the customer’s design from copycats, the company says.

Tekmos, located in Austin, Texas, specializes in “supportable solutions in the development and manufacturing of mature microcontrollers” and “high temperature microprocessors up to 300º C.”